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Patent Searching and Data


Title:
PROMPT METHOD AND SYSTEM FOR BUILDING MODULAR APPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/120151
Kind Code:
A1
Abstract:
A prompt method and system for building a modular apparatus. The prompt method for building a modular apparatus comprises the following steps: S1: acquiring configuration information of a target modular apparatus, wherein the target modular apparatus comprises M unit modules connected through interfacing parts; S2: acquiring configuration information of a currently built entity, wherein the built entity comprises N unit modules connected through the interfacing parts, and N is smaller than M; S3: according to the configuration information of the target modular apparatus and the configuration information of the currently built entity, making a calculation to obtain the position of an interfacing part, on the built entity, which at least an (N+1)th unit module should access; and S4: send out prompt information according to the position of the interfacing part, on the built entity, which at least the (N+1)th unit module should access obtained by calculation in step S3, so as to prompt the position of the interfacing part which at least the (N+1)th unit module should access. By means of the prompt method and system for building a modular apparatus, splicing errors during rebuilding of a modular apparatus can be reduced.

Inventors:
YANG JIANBO (CN)
Application Number:
PCT/CN2018/121437
Publication Date:
June 27, 2019
Filing Date:
December 17, 2018
Export Citation:
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Assignee:
BEIJING KEYI TECH CO LTD (CN)
International Classes:
B25J9/16; B25J9/08
Foreign References:
CN106272550A2017-01-04
DE102015015142A12017-06-01
CN108115686A2018-06-05
US20060095159A12006-05-04
US20060100739A12006-05-11
US20170157768A12017-06-08
Other References:
See also references of EP 3730255A4
Attorney, Agent or Firm:
SHENZHEN I&W INTELLECTUAL PROPERTY CORPORATION (CN)
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