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Patent Searching and Data


Title:
PROPYLENE POLYMER, PROPYLENE RESIN COMPOSITION, AND HOT-MELT ADHESIVE INCLUDING SAID POLYMER AND COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/088359
Kind Code:
A1
Abstract:
[1] A propylene polymer having a melting endotherm (ΔH-D), as measured using differential scanning calorimetry (DSC), of 0 to 80 J/g, and a viscosity, as measured using a B-type viscometer, of 500 to 6000 mPa∙s; [2] a propylene resin composition comprising (A) a resin that includes the propylene polymer and (B) a plasticizer; and [3] a hot-melt adhesive containing the propylene polymer or the propylene resin composition.

Inventors:
FUJII NOZOMU (JP)
KANAMARU MASAMI (JP)
Application Number:
PCT/JP2017/039941
Publication Date:
May 17, 2018
Filing Date:
November 06, 2017
Export Citation:
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Assignee:
IDEMITSU KOSAN CO (JP)
International Classes:
C08F10/06; C08L23/10; C08L91/00; C08L101/00; C09J123/10
Domestic Patent References:
WO2014069606A12014-05-08
WO2014077258A12014-05-22
Foreign References:
JP2016117888A2016-06-30
JP2015509554A2015-03-30
JP2015013920A2015-01-22
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
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