PROTECTION ELEMENT AND METHOD FOR PRODUCING PROTECTION ELEMENT

WIPO Patent Application WO/2011/158851

A1

Provided is a protection element which can rapidly and reliably block a current path, using a corrosion phenomenon caused by molten solder. Electrodes (114) are comprised of a first conductive layer (112) stacked on a substrate (111), and second conductive layers (113) stacked at positions in the planar direction on the substrate (111) having the first conductive layer (112) stacked thereon. Solder paste (116) having greater wettability with the electrodes (114) than with the substrate (111) is deposited over the substrate (111) having the first conductive layer (112) and the second conductive layer (113) stacked thereon, and is melted by at least either heat generated by a resistor (103) or heat generated by the stacked portion composed of each electrode (114) and the solder paste (116). Thus, the molten solder paste (116) is drawn toward each electrode (114), the wettability of which is higher than that of the substrate (111), while corroding portions of the first conductive layer (112) which are exposed between the adjacent electrodes (114), and thus, a current path is blocked.

YONEDA, Yoshihiro (Gate City Osaki East Tower 8F, 1-11-2, Osaki, Shinagawa-k, Tokyo 32, 〒1410032, JP)

JP2011/063648

December 22, 2011

June 15, 2011

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SONY CHEMICAL & INFORMATION DEVICE CORPORATION (Gate City Osaki, East Tower 8F 1-11-2, Osaki, Shinagawa-k, Tokyo 32, 〒1410032, JP)
ソニーケミカル＆インフォメーションデバイス株式会社 (〒32 東京都品川区大崎１丁目１１番２号　ゲートシティ大崎イーストタワー８階 Tokyo, 〒1410032, JP)

H01H37/76

KOIKE, Akira et al. (32F St. Luke's Tower, 8-1 Akashi-cho, Chuo-k, Tokyo 44, 〒1040044, JP)

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