Title:
PROTECTION FILM-PROVIDED CHIP MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/276731
Kind Code:
A1
Abstract:
This protection film-provided chip manufacturing method comprises: a step for attaching, under a reduced pressure environment to a wafer having a projected electrode and on the surface where said projected electrode is provided, a curable resin film (12) included in a protection film-forming sheet (1) provided with a support sheet (11) and the curable resin film (12) provided on one surface (11a) of the support sheet (11); a step for forming a protection film on the surface of the wafer by curing the attached curable resin film (12); and a step for, by dividing the wafer after the protection film has been formed and cutting the protection film, acquiring protection film-provided chips each comprising a chip and a post-cut protection film provided to the chip. A groove which becomes a dividing place of the wafer is formed on the surface of the wafer.
Inventors:
SHINODA TOMONORI (JP)
NEMOTO TAKU (JP)
TAMURA SAKURAKO (JP)
MORISHITA TOMOTAKA (JP)
SHINOMIYA KEISUKE (JP)
NAKAISHI YASUNOBU (JP)
NEMOTO TAKU (JP)
TAMURA SAKURAKO (JP)
MORISHITA TOMOTAKA (JP)
SHINOMIYA KEISUKE (JP)
NAKAISHI YASUNOBU (JP)
Application Number:
PCT/JP2022/024345
Publication Date:
January 05, 2023
Filing Date:
June 17, 2022
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/304; H01L21/301; H01L21/683
Domestic Patent References:
| WO2017077957A1 | 2017-05-11 | |||
| WO2014157329A1 | 2014-10-02 |
Foreign References:
| JP2007220743A | 2007-08-30 | |||
| JP2008081734A | 2008-04-10 | |||
| JP2016076694A | 2016-05-12 | |||
| JP2012169482A | 2012-09-06 |
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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