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Patent Searching and Data


Title:
PROTECTIVE COATING COMPOSITION FOR WAFER PROCESSING AND PROTECTIVE COATING AGENT COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2019/135430
Kind Code:
A1
Abstract:
By forming a coating layer comprising hydroxylated polyurethane on the surface of a wafer, it is possible to prepare a protective coating agent for wafer processing according to the present invention that can fundamentally prevent damage occurring on the surface of the wafer in a processing step including cutting of the wafer during a semiconductor manufacturing process.

Inventors:
PARK, Sung Kyun (#A-3905, 7 Oksan-ro,,Bucheon-si, Gyeonggi-do, 14574, KR)
REW, Ji In (#503-703, 156 Chunggyeong-ro,,Deogyang-gu, Goyang-si, Gyeonggi-do, 10533, KR)
Application Number:
KR2018/000352
Publication Date:
July 11, 2019
Filing Date:
January 08, 2018
Export Citation:
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Assignee:
MTI CO.,LTD. (39 Mongnae-ro 122beon-gil, Danwon-gu, Ansan-si, Gyeonggi-do, 15598, KR)
International Classes:
C09D175/04; C11D1/72; C11D1/83; C11D11/00
Attorney, Agent or Firm:
ERUUM & LEEON INTELLECTUAL PROPERTY LAW FIRM (3rd Floor, 108 Sapyeong-daero,,Seocho-gu, Seoul, 06575, KR)
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