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Patent Searching and Data


Title:
PROTECTIVE COATING COMPOSITION FOR WAFER PROCESSING AND PROTECTIVE COATING AGENT COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2019/135430
Kind Code:
A1
Abstract:
By forming a coating layer comprising hydroxylated polyurethane on the surface of a wafer, it is possible to prepare a protective coating agent for wafer processing according to the present invention that can fundamentally prevent damage occurring on the surface of the wafer in a processing step including cutting of the wafer during a semiconductor manufacturing process.

Inventors:
PARK SUNG KYUN (KR)
REW JI IN (KR)
Application Number:
KR2018/000352
Publication Date:
July 11, 2019
Filing Date:
January 08, 2018
Export Citation:
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Assignee:
MTI CO LTD (15598, KR)
International Classes:
C09D175/04; C11D1/72; C11D1/83; C11D11/00
Foreign References:
KR20090055267A2009-06-02
KR20060010366A2006-02-02
KR20170106574A2017-09-21
KR20150110823A2015-10-02
KR19980071603A1998-10-26
KR20130014610A2013-02-07
KR20180011420A2018-02-01
KR20180018962A2018-02-22
Attorney, Agent or Firm:
ERUUM & LEEON INTELLECTUAL PROPERTY LAW FIRM (06575, KR)
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