Title:
PROTECTIVE-COATING-FORMING SHEET AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP PROVIDED WITH PROTECTIVE COATING
Document Type and Number:
WIPO Patent Application WO/2016/027888
Kind Code:
A1
Abstract:
A protective-coating-forming sheet (3) provided with a first support sheet (4) and a protective-coating formation film (1) layered on a first surface side of the first support sheet (4), the protective-coating formation film (1) comprising a curable material, and the protective-coating formation film (1) having the following characteristics: when the protective-coating formation film (1) is cured and a protective coating is obtained, the breaking strain of the protective coating at 50°C is 20% or less, and the breaking stress thereof at 50°C is 2.0×107 Pa or less.
Inventors:
YAMAMOTO DAISUKE (JP)
SAIKI NAOYA (JP)
YONEYAMA HIROYUKI (JP)
SAIKI NAOYA (JP)
YONEYAMA HIROYUKI (JP)
Application Number:
PCT/JP2015/073545
Publication Date:
February 25, 2016
Filing Date:
August 21, 2015
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; B23K26/53; C09J7/20; H01L21/301
Domestic Patent References:
| WO2007119507A1 | 2007-10-25 | |||
| WO2013172328A1 | 2013-11-21 | |||
| WO2004109786A1 | 2004-12-16 | |||
| WO2013121701A1 | 2013-08-22 | |||
| WO2015145807A1 | 2015-10-01 |
Foreign References:
| JP2011139042A | 2011-07-14 | |||
| JP2013120841A | 2013-06-17 |
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
Masatake Shiga (JP)
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