Title:
PROTECTIVE FILM FORMING AGENT FOR PLASMA DICING AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP
Document Type and Number:
WIPO Patent Application WO/2020/100403
Kind Code:
A1
Abstract:
Provided are: a protective film forming agent for plasma dicing with which an opening (machined groove) of a desired shape can be favorably formed by irradiating a desired location of a protective film with laser light when manufacturing a semiconductor chip by cutting a semiconductor substrate by plasma dicing; and a method of manufacturing a semiconductor chip that uses the protective film forming agent for plasma dicing. The protective film forming agent for plasma dicing comprises a water soluble resin (A), a light absorbing agent (B), and a solvent (S), wherein the water soluble resin (A) that is used exhibits a weight loss rate of 80 weight% or more when the temperature is raised to 500°C in thermogravimetry.
Inventors:
KINOSHITA TETSURO (JP)
UEMATSU TERUHIRO (JP)
UEMATSU TERUHIRO (JP)
Application Number:
PCT/JP2019/035966
Publication Date:
May 22, 2020
Filing Date:
September 12, 2019
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
H01L21/301
Foreign References:
| JP2017042786A | 2017-03-02 | |||
| JP2005189527A | 2005-07-14 | |||
| JP2005266663A | 2005-09-29 | |||
| JP2014523112A | 2014-09-08 |
Other References:
See also references of EP 3882959A4
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
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