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Patent Searching and Data


Title:
PROTECTIVE FILM-FORMING COMPOSITE SHEET AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP PROVIDED WITH PROTECTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2019/172439
Kind Code:
A1
Abstract:
Provided is a protective film-forming composite sheet, comprising: a supporting sheet comprising a substrate; and a thermosetting protective film-forming film disposed on the supporting sheet, the substrate having a loss tangent (tan δ) at -15ºC of 0.05 or higher and a storage modulus (G') at 80ºC of 35.0 MPa or higher.

Inventors:
FURUNO Kenta (23-23 Honcho, Itabashi-k, Tokyo 01, 〒1730001, JP)
YONEYAMA Hiroyuki (23-23 Honcho, Itabashi-k, Tokyo 01, 〒1730001, JP)
Application Number:
JP2019/009449
Publication Date:
September 12, 2019
Filing Date:
March 08, 2019
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Assignee:
LINTEC CORPORATION (23-23, Honcho Itabashi-k, Tokyo 01, 〒1730001, JP)
International Classes:
B32B7/022; B23K26/00; B23K26/53; C09J7/10; C09J201/00; H01L21/301; H01L23/00
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (1-9-2, Marunouchi Chiyoda-k, Tokyo 20, 〒1006620, JP)
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