Title:
PROTECTIVE FILM-FORMING LAYER, SHEET FOR FORMING PROTECTIVE FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/017473
Kind Code:
A1
Abstract:
[Problem] To provide: a protective film-forming layer which exhibits excellent bonding strength to a chip even after exposure to severe wet heat conditions and a reflow process after storage of a certain period of time; a sheet for forming a protective film, which has this protective film-forming layer; and a method for manufacturing a semiconductor device, which uses this sheet.
[Solution] A protective film-forming layer of the present invention contains (A) a binder polymer component, (B) a thermosetting component, (C) an inorganic filler, (D) a silane coupling agent which contains an alkoxy group and a reactive functional group other than an alkoxyl group, and has a molecular weight of 300 or more and an alkoxy equivalent of more than 13 mmol/g, and (E) a silane coupling agent which contains an alkoxy group and a reactive functional group other than an alkoxyl group, and has a molecular weight of 300 or less and an alkoxy equivalent of 13 mmol/g or less.
Inventors:
TAKANO KEN (JP)
AZUMA YUICHIRO (JP)
ICHIKAWA ISAO (JP)
AZUMA YUICHIRO (JP)
ICHIKAWA ISAO (JP)
Application Number:
PCT/JP2013/069888
Publication Date:
January 30, 2014
Filing Date:
July 23, 2013
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L23/29; C09J7/00; C09J11/04; C09J11/06; C09J133/00; C09J163/00; C09J201/00; H01L21/301; H01L23/31
Domestic Patent References:
| WO2010026992A1 | 2010-03-11 |
Foreign References:
| JP2000183382A | 2000-06-30 | |||
| JP2012124340A | 2012-06-28 | |||
| JP2011253907A | 2011-12-15 | |||
| JP2012505295A | 2012-03-01 |
Attorney, Agent or Firm:
MAEDA & SUZUKI (JP)
Maeda and a Suzuki international patent business corporation (JP)
Maeda and a Suzuki international patent business corporation (JP)
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