PROTECTIVE FILM STRUCTURE OF METAL MEMBER, METAL COMPONENT EMPLOYING PROTECTIVE FILM STRUCTURE, AND EQUIPMENT FOR PRODUCING SEMICONDUCTOR OR FLAT-PLATE DISPLAY EMPLOYING PROTECTIVE FILM STRUCTURE

Title:

PROTECTIVE FILM STRUCTURE OF METAL MEMBER, METAL COMPONENT EMPLOYING PROTECTIVE FILM STRUCTURE, AND EQUIPMENT FOR PRODUCING SEMICONDUCTOR OR FLAT-PLATE DISPLAY EMPLOYING PROTECTIVE FILM STRUCTURE

Document Type and Number:

WIPO Patent Application WO/2006/135043

Kind Code:

A1

Abstract:

Multifunction production equipment enabling a plurality of processes in which deposition of reaction products on the inner wall of the processing chamber of equipment for producing a semiconductor or a flat-plate display, metal contamination due to corrosion of the inner wall, or the like, and fluctuation of the process due to discharged gas are suppressed, and a protective film structure for use therein. On the surface of a metal material, a first coating layer having an oxide coating of 1 μ thick or less formed as an underlying layer by direct oxidation of a parent material, and a second coating layer of about 200μm thick are formed. With such an arrangement, corrosion resistance against irradiation with ions or radicals can be imparted to a second layer protective film, and the effect of a protective layer for preventing corrosion of the surface of parent metal caused by diffusing molecules or ions into the second layer protective film can be imparted to the first layer oxide film. Consequently, contamination of the substrate with metals generated from each metal member and the inner surface of the process chamber is reduced, and stripping of the second layer protective film due to lowering in adhesion of the second layer protective film due to corrosion of the interface between the parent material and the second layer protective film can be suppressed.

Inventors:

OHMI TADAHIRO (JP)
SHIRAI YASUYUKI (JP)
MORINAGA HITOSHI (JP)
KAWASE YASUHIRO (JP)
KITANO MASAFUMI (JP)
MIZUTANI FUMIKAZU (JP)
ISHIKAWA MAKOTO (JP)
KISHI YUKIO (JP)

Application Number:

PCT/JP2006/312110

Publication Date:

December 21, 2006

Filing Date:

June 16, 2006

Export Citation:

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Assignee:

UNIV TOHOKU (JP)
MITSUBISHI CHEM CORP (JP)
NIHON CERATEC CO LTD (JP)
OHMI TADAHIRO (JP)
SHIRAI YASUYUKI (JP)
MORINAGA HITOSHI (JP)
KAWASE YASUHIRO (JP)
KITANO MASAFUMI (JP)
MIZUTANI FUMIKAZU (JP)
ISHIKAWA MAKOTO (JP)
KISHI YUKIO (JP)

International Classes:

C23C28/00; C23C8/10; C25D11/08; C25D11/10; C25D11/16; C25D11/18; H01L21/205; H01L21/3065

Foreign References:

JP2002356761A	2002-12-13
JPH11302824A	1999-11-02
JPH07233476A	1995-09-05
JP2001104774A	2001-04-17
JP2003179037A	2003-06-27
JP2003166043A	2003-06-13

Other References: