Title:
PROTECTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2018/199172
Kind Code:
A1
Abstract:
This protective film 10 is used adhered on to a resin substrate 21, when thermal-bending the resin substrate 21 under heat. The protective film 10 has a base material layer and an adhesive layer positioned between this base material layer and the resin substrate 21 and adhering to the resin substrate 21. The adhesive layer contains polyolefin and a styrene block elastomer having a styrene content of no more than 25 wt%.
Inventors:
ONODERA KAZUFUSA (JP)
Application Number:
PCT/JP2018/016834
Publication Date:
November 01, 2018
Filing Date:
April 25, 2018
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
B29C53/04; B32B27/00; B32B27/28; C09J7/20; C09J7/30; C09J7/38; C09J123/00; C09J153/02
Domestic Patent References:
| WO2014054700A1 | 2014-04-10 | |||
| WO2014189078A1 | 2014-11-27 | |||
| WO2011122288A1 | 2011-10-06 | |||
| WO2015129426A1 | 2015-09-03 |
Foreign References:
| JP2010275340A | 2010-12-09 | |||
| JP2003145616A | 2003-05-20 |
Attorney, Agent or Firm:
ASAHI, Kazuo et al. (JP)
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