Title:
PROTECTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2019/182047
Kind Code:
A1
Abstract:
The protective film 10 of the present invention comprises a base layer and a pressure-sensitive adhesive layer and is applied to a resin base 21 to be subjected to bending with heating. The pressure-sensitive adhesive layer comprises a polyolefin having a melting point lower than 125°C. The base layer comprises a first layer, which comprises a polyolefin having a melting point of 150°C or higher, and a second layer, which comprises an adhesive resin. When the protective film 100, which has such configuration, is sandwiched between two receiving substrates each constituted of a polycarbonate and this stack is heated at 145°C for 30 minutes, thereafter the receiving substrate on the pressure-sensitive-layer side is peeled off at 25°C, and the surface of said receiving substrate is viewed from a plan-view direction, then the areal proportion of a residue of the pressure-sensitive adhesive layer is 5% or less.
Inventors:
ONODERA KAZUFUSA (JP)
INABA HIRONARI (JP)
INABA HIRONARI (JP)
Application Number:
PCT/JP2019/011834
Publication Date:
September 26, 2019
Filing Date:
March 20, 2019
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
B32B27/00; B29C51/14; B32B27/32; C09J7/22; C09J7/38; C09J123/00; C09J153/00; G02B5/30
Domestic Patent References:
| WO2014115705A1 | 2014-07-31 | |||
| WO2016067937A1 | 2016-05-06 |
Foreign References:
| JP2009262423A | 2009-11-12 | |||
| JP2017081160A | 2017-05-18 | |||
| JP2003145616A | 2003-05-20 |
Other References:
See also references of EP 3769961A4
Attorney, Agent or Firm:
ASAHI, Kazuo et al. (JP)
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