Title:
PROTECTIVE FLUID FOR ALUMINA, PROTECTION METHOD, AND PRODUCTION METHOD FOR SEMICONDUCTOR SUBSTRATE HAVING ALUMINA LAYER USING SAME
Document Type and Number:
WIPO Patent Application WO/2019/167971
Kind Code:
A1
Abstract:
The present invention pertains to a protective fluid for alumina, a protection method, and a production method for semiconductor substrate having an alumina layer using same. This alumina protective fluid is characterized by: containing 0.0001%–20 % by mass of an alkali earth metal compound; and the alkali earth metal compound being at least one selected from the group consisting of beryllium, magnesium, strontium, and barium. As a result of the present invention, alumina corrosion can be suppressed during the production process for semiconductor circuits.
Inventors:
OIE TOSHIYUKI (JP)
PUTRA PRIANGGA PERDANA (JP)
HORITA AKINOBU (JP)
PUTRA PRIANGGA PERDANA (JP)
HORITA AKINOBU (JP)
Application Number:
PCT/JP2019/007409
Publication Date:
September 06, 2019
Filing Date:
February 27, 2019
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
H01L21/316; C01F7/021
Foreign References:
| JP2000284487A | 2000-10-13 | |||
| JP2014090156A | 2014-05-15 | |||
| JPH08181048A | 1996-07-12 | |||
| JP2003195517A | 2003-07-09 | |||
| JP2013534039A | 2013-08-29 |
Other References:
"Etch stop materials for release by vapor HF etching", 16TH MME WORKSHOP, GOETEBORG, SWEDEN, 2005
See also references of EP 3761346A4
See also references of EP 3761346A4
Attorney, Agent or Firm:
KOBAYASHI Hiroshi et al. (JP)
Download PDF: