Title:
PROTECTIVE-MEMBRANE-FORMING COMPOSITE SHEET, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP
Document Type and Number:
WIPO Patent Application WO/2019/082969
Kind Code:
A1
Abstract:
A protective-membrane-forming composite sheet including a support sheet and an energy-ray-curable protective-membrane-forming film provided on the support sheet, wherein the protective-membrane forming film contains an energy-ray-curable component (a0) and a non-energy-ray-curable polymer (b), a layer of the support film in contact with the protective-membrane-forming film contains a resin component (X), the HSP distance R23A of the energy-ray-curable component (a0) and the non-energy-ray-curable polymer (b) is 6.5 or less, and the HSP distance R13A of the energy-ray-curable component (a0) and the resin component (X) is 2.2 or greater.
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Inventors:
KOBASHI RIKIYA (JP)
INAO YOUICHI (JP)
INAO YOUICHI (JP)
Application Number:
PCT/JP2018/039670
Publication Date:
May 02, 2019
Filing Date:
October 25, 2018
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; H01L21/301; H01L23/00; H01L23/29; H01L23/31
Domestic Patent References:
| WO2017073627A1 | 2017-05-04 | |||
| WO2017188205A1 | 2017-11-02 |
Foreign References:
| JP2017194633A | 2017-10-26 |
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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