Title:
PROTECTIVE TAPE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2018/047776
Kind Code:
A1
Abstract:
[Problem] To provide a protective tape for wafers, which has excellent thermal dimensional stability and is able to be used at higher temperatures than conventional protective tapes.
[Solution] A protective tape 10 which comprises: a resin film substrate 11 that has a transmittance of 50% or more for light at 365 nm, while having a dimensional change rate of from -1.5% to +1.5% (inclusive) in both the machine direction (MD) and the transverse direction (TD) if held at 150°C for 30 minutes, with the difference between the dimensional change rate in MD and the dimensional change rate in TD being 1% or less; and an ultraviolet curable adhesive layer 12.
Inventors:
NAKANO MASASHI (JP)
NISHIMATSU HIDEAKI (JP)
ODAGAWA TOMOHIKO (JP)
NISHIMATSU HIDEAKI (JP)
ODAGAWA TOMOHIKO (JP)
Application Number:
PCT/JP2017/031828
Publication Date:
March 15, 2018
Filing Date:
September 04, 2017
Export Citation:
Assignee:
KURASHIKI BOSEKI KK (JP)
International Classes:
H01L21/304; C09J4/00
Domestic Patent References:
| WO2014030474A1 | 2014-02-27 |
Foreign References:
| JP2012177084A | 2012-09-13 | |||
| JP2003138228A | 2003-05-14 | |||
| JP2004311750A | 2004-11-04 |
Attorney, Agent or Firm:
KAWAHARA, Tetsuro (JP)
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