PSEUDOCROSSLINKING RESIN COMPOSITION, MOLDED MATERIALS, SHEET, OR FILM MADE THEREFROM, AND OPTICAL ELEMENTS

Title:

PSEUDOCROSSLINKING RESIN COMPOSITION, MOLDED MATERIALS, SHEET, OR FILM MADE THEREFROM, AND OPTICAL ELEMENTS

Document Type and Number:

WIPO Patent Application WO/2002/098980

Kind Code:

A1

Abstract:

A pseudocrosslinking resin composition comprising either a resin produced by a process which comprises mixing a vinyl polymer (A) bearing one or more atomic groups capable of forming an intermolecular hydrogen bond in the side chain of the molecule and&sol or at the end thereof with a vinyl polymer (B) bearing one or more atomic groups capable of forming an intermolecular hydrogen bond in the side chain of the molecule and&sol or in the skeleton thereof to thereby form intermolecular hydrogen bonds, wherein the polymer (A) is a (co)polymer bearing one or more carboxyl or hydroxyl groups at the end and the polymer (B) is a (co)polymer having at least one nitrogen atom in the side chain of the molecule and&sol or in the skeleton thereof, or a mixture of resins produced by the process, and a silicone resin represented by the general formula (1): (1) [wherein R is C_pH_{2p&plus 1} (wherein p is an integer of 4 or below)&semi and n and m are each an integer representing a degree of polymerization]. The invention facilitates the blending of polymers and enables the exhibition of novel performances, thus providing a resin composition having incompatible characteristics.

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Inventors:

YAMASHITA YUKIHIKO (JP)
KANEMARU KENJI (JP)
SAITO KOICHI (JP)

Application Number:

PCT/JP2002/005537

Publication Date:

December 12, 2002

Filing Date:

June 05, 2002

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD (JP)
YAMASHITA YUKIHIKO (JP)
KANEMARU KENJI (JP)
SAITO KOICHI (JP)

International Classes:

C08G81/02; C08L33/02; C08L33/14; C08L43/04; C08L57/10; C08L57/12; C08L83/06; C08L83/04; (IPC1-7): C08L57/10; C08J5/18; C08L57/12; C08L83/06; G02B1/04

Foreign References:

JP2000273319A	2000-10-03
JP2002038036A	2002-02-06
JP2000129173A	2000-05-09
JP2002105344A	2002-04-10

Other References: