PULSED SPUTTERING APPARATUS AND PULSED SPUTTERING METHOD

Title:

PULSED SPUTTERING APPARATUS AND PULSED SPUTTERING METHOD

Document Type and Number:

WIPO Patent Application WO/2014/132852

Kind Code:

A1

Abstract:

The present invention reduces the size of an inert gas supply and discharge apparatus used in a pulsed sputtering apparatus. An appropriate quantity of an inert gas is efficiently supplied to locations where the inert gas is needed in the pulsed sputtering apparatus. The pulsed sputtering apparatus is provided with a sputtering source that performs pulsed discharges and generates plasma, a gas injection valve that injects and supplies the inert gas to the sputtering source, and a control means for controlling the sputtering source and the gas injection valve. The control means controls the sputtering source and the gas injection valve in such a manner that the gas injection valve intermittently injects the inert gas, and in such a manner that a portion of a period in which the pulse discharges generated in the sputtering source overlaps with a portion of a period in which the inert gas is injected and supplied by the gas injection valve.

Inventors:

TSUKAMOTO KEIZO (JP)

Application Number:

PCT/JP2014/053850

Publication Date:

September 04, 2014

Filing Date:

February 19, 2014

Export Citation:

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Assignee:

AYABO CORP (JP)

International Classes:

C23C14/34

Foreign References:

JPS61261473A	1986-11-19
JP2012099226A	2012-05-24
JPH042771A	1992-01-07
JP2003247064A	2003-09-05
JP2010512458A	2010-04-22
JP2010512459A	2010-04-22

Other References: