Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PUNCH HEIGHT MEASUREMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/166546
Kind Code:
A1
Abstract:
A punch height measurement device (10) is provided with a support block (12) having a support surface (12f) for supporting an attachment reference surface (Pf) of a punching die (P), and a pressing member (14) for holding the proximal-end part of the punching die (P) cooperatively with the support block (12). A measuring instrument (40) is provided for measuring the distance from the support surface (12f) of the support block (12) to the distal end (Pt) of the punching die (P) in a state in which the attachment reference surface of the punching die (P) is supported in a position facing the support surface (12f) of the support block (12).

Inventors:
HAYASHI SHIRO (JP)
MIYASHITA NOBUHITO (JP)
Application Number:
PCT/JP2020/005049
Publication Date:
August 20, 2020
Filing Date:
February 10, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
AMADA HOLDINGS COLTD (JP)
International Classes:
B21D5/02; B23Q17/00
Foreign References:
JPS60142038U1985-09-20
JP2018505061A2018-02-22
JP2004237323A2004-08-26
JPS5425583U1979-02-20
JPS57122343U1982-07-30
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
Download PDF:



 
Previous Patent: BIOSENSOR

Next Patent: SYNTHETIC RESIN CONTAINER LID