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Patent Searching and Data


Title:
PUNCH HOLE FORMING METHOD AND PUNCH HOLE FORMING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/189910
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a punch hole forming method and a punch hole forming device, wherein when punching out a workpiece by means of a processing tool to form a hole, a decrease in the temperature of the workpiece due to the processing tool can be suppressed. In the punch hole forming method, a workpiece O that is a plate-shaped member having the thickness of 0.01 to 1 mm is placed on a die 10, and when punching out the workpiece O in the thickness direction by means of a punch 20 to form a hole, the temperature of the workpiece O is maintained at least while the hole is being formed at a temperature TO at which the punching out of the workpiece O is possible.

Inventors:
SHINKE NORIHISA (JP)
ECHIGO MITSUAKI (JP)
TSUDA YUJI (JP)
Application Number:
PCT/JP2019/014375
Publication Date:
October 03, 2019
Filing Date:
March 29, 2019
Export Citation:
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Assignee:
OSAKA GAS CO LTD (JP)
International Classes:
B21D28/34; B21D28/24; B21D28/26; B21D37/01; B21D37/16
Domestic Patent References:
WO2014181882A12014-11-13
Foreign References:
JP2009241088A2009-10-22
JPS6393413A1988-04-23
JP2000094066A2000-04-04
JP2017019028A2017-01-26
JPS5573428A1980-06-03
JPH08309473A1996-11-26
JPH08309473A1996-11-26
Other References:
See also references of EP 3785819A4
Attorney, Agent or Firm:
R&C IP LAW FIRM (JP)
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