Title:
PURE COPPER MATERIAL, INSULATING SUBSTRATE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/024899
Kind Code:
A1
Abstract:
A pure copper material according to the present invention has a Cu content within the range of 99.9 mass% to 99.999 mass%, while having an average crystal grain size of 10 μm or more in a rolled surface; and if a measurement area of 1 mm2 or more is measured by means of an EBSD method in steps with measurement intervals of 1 μm and the boundaries at which the misorientation between adjacent pixels is 5° or more are considered as crystal grain boundaries, while excluding the measurement points at which the CI value as obtained by an analysis using a data analysis software OIM is 0.1 or less, the average of angle differences (misorientation angles) between crystals which are adjacent to each other across a crystal grain boundary is 40° or more.
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| JPH09118944 | COPPER ALLOY FOR ELECTRIC/ELECTRONIC PARTS |
Inventors:
ODAIRA TAKUMI (JP)
ITO YUKI (JP)
KAWASAKI KENICHIRO (JP)
MAKI KAZUNARI (JP)
ITO YUKI (JP)
KAWASAKI KENICHIRO (JP)
MAKI KAZUNARI (JP)
Application Number:
PCT/JP2023/027616
Publication Date:
February 01, 2024
Filing Date:
July 27, 2023
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C22C9/00; C22F1/00; C22F1/08; H01B1/02
Domestic Patent References:
| WO2021177469A1 | 2021-09-10 | |||
| WO2021107096A1 | 2021-06-03 | |||
| WO2021177470A1 | 2021-09-10 | |||
| WO2021177461A1 | 2021-09-10 | |||
| WO2021177460A1 | 2021-09-10 | |||
| WO2020162445A1 | 2020-08-13 | |||
| WO2020122112A1 | 2020-06-18 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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