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Title:
PURE COPPER PLATE PRODUCTION METHOD, AND PURE COPPER PLATE
Document Type and Number:
WIPO Patent Application WO/2011/099426
Kind Code:
A1
Abstract:
Disclosed is a pure copper plate production method wherein post-hot-forging and post-hot-rolling cold forging and cold rolling, and subsequent heat processing are unnecessary. Further disclosed is a pure copper plate having a fine structure which is obtained according to the disclosed production method and which is provided with a high special grain boundary ratio due to the formation of a twin crystal structure by means of partial recrystalisation, and is particularly suitable for copper target members for sputtering, or anodes for plating, or similar. A pure copper ingot having a purity level of 99.96 weight% or higher is heated to 550-800˚C. A hot-rolling process is carried out wherein the total rolling rate is 85% or higher, the temperature at rolling completion is 500-700˚C, and which includes at least one finishing rolling pass having a rolling reduction rate for one pass of 5-24%. Then, rapid cooling from the rolling completion temperature to 200˚C or lower is carried out at a cooling speed of 200-1000˚C/min, as required.

Inventors:
SAKAI, Toshihiro (Sambo Plant, 8-374, Sambo-Cho, Sakai-ku, Sakai-sh, Osaka 06, 〒5900906, JP)
酒井 俊寛 (〒06 大阪府堺市堺区三宝町8-374 三菱伸銅株式会社 三宝製作所内 Osaka, 〒5900906, JP)
TAKEDA, Takahiro (Sambo Plant, 8-374, Sambo-Cho, Sakai-ku, Sakai-sh, Osaka 06, 〒5900906, JP)
竹田 隆弘 (〒06 大阪府堺市堺区三宝町8-374 三菱伸銅株式会社 三宝製作所内 Osaka, 〒5900906, JP)
KITA, Koichi (Central Research Institute 1975-2, Shimoishitokami, Kitamoto-sh, Saitama 22, 〒3640022, JP)
Application Number:
JP2011/052317
Publication Date:
August 18, 2011
Filing Date:
February 04, 2011
Export Citation:
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Assignee:
MITSUBISHI SHINDOH CO., LTD. (4-7-35, Kitashinagawa Shinagawa-k, Tokyo 50, 〒1408550, JP)
三菱伸銅株式会社 (〒50 東京都品川区北品川4-7-35 Tokyo, 〒1408550, JP)
MITSUBISHI MATERIALS CORPORATION (3-2 Otemachi 1-chome, Chiyoda-ku Tokyo, 17, 〒1008117, JP)
三菱マテリアル株式会社 (〒17 東京都千代田区大手町一丁目3番2号 Tokyo, 〒1008117, JP)
SAKAI, Toshihiro (Sambo Plant, 8-374, Sambo-Cho, Sakai-ku, Sakai-sh, Osaka 06, 〒5900906, JP)
酒井 俊寛 (〒06 大阪府堺市堺区三宝町8-374 三菱伸銅株式会社 三宝製作所内 Osaka, 〒5900906, JP)
TAKEDA, Takahiro (Sambo Plant, 8-374, Sambo-Cho, Sakai-ku, Sakai-sh, Osaka 06, 〒5900906, JP)
International Classes:
C22F1/08; B21B3/00; C23C14/34; C25D17/10; C22F1/00
Attorney, Agent or Firm:
AOYAMA, Masakazu (Seiyo Patent Office, 701,Akiba Bldg., 3-3, Akihabara,,Taito-k, Tokyo 06, 〒1100006, JP)
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Claims: