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Patent Searching and Data


Title:
PURGING DEVICE AND PURGING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/022062
Kind Code:
A1
Abstract:
Provided is a purging device that is capable of preventing the entraining of air when a submersible pump is placed inside a pump column, that is capable of heating the submersible pump to prevent liquefaction of airborne components upon removing the submersible pump from the pump column, and that is capable of preventing liquefied gas from being released into the atmosphere. The purging device comprises: a sealed purge vessel (1) for housing a submersible pump (2); a vacuum line (37) connected to the sealed purge vessel (1) and also connected to a vacuum source (39); a purge gas supply line (38) connected to the sealed purge vessel (1) and also connected to a purge gas supply source (40B); and a purge gas supply valve (35) attached to the purge gas supply line (38).

Inventors:
HONDA SHUICHIRO (JP)
KASATANI TETSUJI (JP)
IKEDA HAYATO (JP)
IWAMI MITSUTAKA (JP)
WATAJI KEI (JP)
KIKUCHI HYUGA (JP)
Application Number:
PCT/JP2022/030387
Publication Date:
February 23, 2023
Filing Date:
August 09, 2022
Export Citation:
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Assignee:
EBARA CORP (JP)
International Classes:
F04B15/08; F04B53/22; F04D7/00; F04D13/08; F04D29/60
Domestic Patent References:
WO2006049055A12006-05-11
Foreign References:
JPS57137684A1982-08-25
JP2008078285A2008-04-03
JPS5030281B11975-09-30
JP2000120992A2000-04-28
JPS5287701A1977-07-22
JP3197645B22001-08-13
JP3198248B22001-08-13
JP3472379B22003-12-02
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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