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Title:
PZT THIN FILM LAMINATE AND METHOD FOR PRODUCING PZT THIN FILM LAMINATE
Document Type and Number:
WIPO Patent Application WO/2015/198882
Kind Code:
A1
Abstract:
The present invention provides a technique for suppressing the formation of a pyrochlore phase, which is an impurity phase, without using a conventional seed layer during the formation of a PZT thin film by sputtering. The present invention is a PZT thin film laminate which comprises: a Pt electrode layer (5) that is provided on an Si substrate (10) with a TiOx layer (4), which serves as a platinum adhesion layer, being interposed therebetween; a Ti thin film layer (6) that is formed on the Pt electrode layer (5); and a PZT thin film layer (7) that is formed on the Ti thin film layer (6). The thickness of the Ti thin film layer (6) can be set to a value from 1 nm to 10 nm (inclusive).

Inventors:
HIROSE MITSUTAKA (JP)
KOBAYASHI HIROKI (JP)
ITSUMI MITSUNORI (JP)
TSUKAGOSHI KAZUYA (JP)
TSUYUKI TATSURO (JP)
KIMURA ISAMU (JP)
SUU KOUKOU (JP)
Application Number:
PCT/JP2015/066847
Publication Date:
December 30, 2015
Filing Date:
June 11, 2015
Export Citation:
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Assignee:
ULVAC INC (JP)
International Classes:
H01L41/319; C23C14/08; C23C14/34; H01L41/047; H01L41/29; H01L41/316
Domestic Patent References:
WO2012160972A12012-11-29
Foreign References:
JP2003174211A2003-06-20
JP2003086586A2003-03-20
JP2005203761A2005-07-28
Other References:
See also references of EP 3163641A4
Attorney, Agent or Firm:
ABE, Hideki et al. (JP)
Hideki Abe (JP)
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