Title:
QUALITY MANAGEMENT SYSTEM
Document Type and Number:
WIPO Patent Application WO/2015/118997
Kind Code:
A1
Abstract:
Provided is a quality management system in a surface mounting line, the system performing: a solder printing step in which a solder is printed onto a printed board by a solder printing device; a mounting step in which an electronic component is disposed on the printed board by a mounter; and a reflow step in which the electronic component is solder-jointed by a reflow furnace. The quality management system comprises: a terminal detection device that, following the mounting step, generates terminal information pertaining to the position of a terminal of the electronic component which has been disposed on the printed board; and a mounting inspection device that, following the reflow step, identifies the position of the terminal belonging to the electronic component on the basis of the terminal information and inspects the state of solder joint between the terminal and the printed board.
Inventors:
MORI HIROYUKI (JP)
NISHI TAKAYUKI (JP)
NISHI TAKAYUKI (JP)
Application Number:
PCT/JP2015/052211
Publication Date:
August 13, 2015
Filing Date:
January 27, 2015
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
G01N21/956; G01B11/00; G01B15/00; G01N23/04; H05K3/34; H05K13/04; H05K13/08
Domestic Patent References:
| WO2012096003A1 | 2012-07-19 |
Foreign References:
| JPH0372204A | 1991-03-27 | |||
| JP2006010429A | 2006-01-12 | |||
| JPH09321500A | 1997-12-12 | |||
| JP2007078533A | 2007-03-29 | |||
| JPH07321492A | 1995-12-08 |
Other References:
See also references of EP 3104169A4
Attorney, Agent or Firm:
SERA Kazunobu et al. (JP)
Kazunobu Sera (JP)
Kazunobu Sera (JP)
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