Title:
QUANTUM DEVICE, PREPARATION METHOD THEREFOR, AND QUANTUM COMPUTER
Document Type and Number:
WIPO Patent Application WO/2023/124666
Kind Code:
A1
Abstract:
A quantum device, a quantum device preparation method, and a quantum computer, which belong to the field of quantum information. An embodiment comprises: a first substrate having a first quantum circuit and a first interconnection element connected to the first quantum circuit, a second substrate having a second quantum circuit and a second interconnection element connected to the second quantum circuit, the second interconnection element being joined to the first interconnection element, and a support element located between the first substrate and the second substrate. In the present application, the support element provides relatively rigid support for the first substrate and the second substrate, thereby defining planes occupied by the first substrate and the second substrate as relatively parallel, which consequently can ensure that when the first interconnection element is joined to the second interconnection element, the sum of the thicknesses of the first interconnection element and the second interconnection elements is the same as the thickness of the support element, thus guaranteeing that the thickness of the interconnection structures has height uniformity, preventing the problem of uneven spacing between substrates.
Inventors:
WANG NIANCI (CN)
LI YE (CN)
LI YE (CN)
Application Number:
PCT/CN2022/134002
Publication Date:
July 06, 2023
Filing Date:
November 24, 2022
Export Citation:
Assignee:
ORIGIN QUANTUM COMPUTING TECH HEFEI CO LTD (CN)
International Classes:
H10N69/00; H10N60/80; H10N60/81
Foreign References:
| CN110462836A | 2019-11-15 | |||
| CN216698425U | 2022-06-07 | |||
| CN113690363A | 2021-11-23 |
Attorney, Agent or Firm:
PATENTSINO IP FIRM (CN)
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