QUARTZ GLASS MEMBER WITH INCREASED EXPOSED AREA, METHOD FOR MANUFACTURING SAME, AND BLADE WITHI MULTIPLE PERIPHERAL CUTTING EDGES

WIPO Patent Application WO/2017/217309

A1

Provided are a quartz glass member having an increased exposed area, of which the area exposed to a film-forming process gas is increased compared with the exposed area of a flat surface quartz glass member, the increased exposed area being controlled so as to achieve a constant amount of surface adsorption, a method for manufacturing the same, and a blade having multiple peripheral cutting edges for use therewith. A quartz glass member for exposure to a film-forming process gas is disposed, during a semiconductor substrate film-forming process, in a reaction chamber together with a semiconductor substrate to be subjected to the film-forming process, and is exposed to a the film-forming process gas. The quartz glass member comprises a quartz glass member body and a plurality of uneven portions formed on a surface of the quartz glass member body, wherein the area exposed to the film-forming process gas is controlled and increased.

JPS6337638	MANUFACTURE OF SEMICONDUCTOR DEVICE
JP4850811	Bench, processing equipment and processing system
JPS637366	MAGNETRON SPUTTERING DEVICE

TSUCHIDA AKIYOSHI (JP)
FUJII NORIKAZU (JP)
MAKITA YOSHIKI (JP)

PCT/JP2017/021265

December 21, 2017

June 08, 2017

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SHIN-ETSU QUARTZ PRODUCTS CO LTD (JP)
FUKUI SHIN-ETSU QUARTZ PRODUCTS CO LTD (JP)

H01L21/31; B24B19/02; B24D5/00; C03C19/00; C23C16/44

JP2015173154A	2015-10-01
JP2001118836A	2001-04-27
JP2005207881A	2005-08-04
JP2003326464A	2003-11-18
JP2001105330A	2001-04-17
JP2017092093A	2017-05-25

See also references of EP 3471131A4

ISHIHARA, Shinsuke et al. (JP)

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