Title:
RADIATION CURING CONDUCTIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2005/056686
Kind Code:
A1
Abstract:
Disclosed is a radiation curing conductive composition which contains an organic conductive polymer such as a polythiophene, a polyaniline or a derivative of those; a water-soluble or aqueous emulsion-forming compound; a water-soluble or aqueous emulsion-forming epoxy or oxethane compound; a cationic photopolymerization photosensitizer and/or a radical polymerization photosensitizer; and if necessary a water-soluble or water-dispersible resin water, water or a water-soluble organic solvent.
Inventors:
HARADA TAKAMASA (JP)
Application Number:
PCT/JP2004/018160
Publication Date:
June 23, 2005
Filing Date:
December 06, 2004
Export Citation:
Assignee:
AZ ELECTRONIC MATERIALS JAPAN (JP)
HARADA TAKAMASA (JP)
HARADA TAKAMASA (JP)
International Classes:
C08L101/12; C08G18/67; C08G59/20; C08G65/18; C08L63/00; H01B1/12; H01B1/20; H05F1/00; (IPC1-7): C08L101/12; H01B1/20; H05F1/00
Domestic Patent References:
| WO1997007167A1 | 1997-02-27 |
Foreign References:
| JPH10176123A | 1998-06-30 | |||
| JPH0912968A | 1997-01-14 | |||
| JPH09279025A | 1997-10-28 |
Attorney, Agent or Firm:
Kanao, Hiroki (Bandai Bldg. 2nd Floor 10-14, Kandaawajicho 2-chom, Chiyoda-ku Tokyo 63, JP)
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