Title:
RADIATION CURING RESIN COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2004/041888
Kind Code:
A1
Abstract:
A radiation curing resin composition is characterized by containing an inorganic component including silica particles composed of a hydrolyzate of an oligomer of alkoxy silane and a monomer and/or an oligomer thereof, and by having a viscosity of 1,000-10,000 centipoises at 25 &ring C.
Inventors:
ESAKI AKIRA (JP)
MATSUDA OSAMU (JP)
MATSUDA OSAMU (JP)
Application Number:
PCT/JP2003/014193
Publication Date:
May 21, 2004
Filing Date:
November 07, 2003
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
ESAKI AKIRA (JP)
MATSUDA OSAMU (JP)
ESAKI AKIRA (JP)
MATSUDA OSAMU (JP)
International Classes:
C08F290/06; C08F292/00; C08F299/00; C08F299/08; C08G18/67; C08G18/75; C08L51/08; C08L51/10; C08L75/16; G11B7/254; G11B7/2542; G11B7/26; C08K9/06; G11B7/243; G11B7/253; G11B7/2534; G11B7/2545; (IPC1-7): C08F299/08; G11B7/24; G11B7/26
Foreign References:
| JP2002038028A | 2002-02-06 | |||
| JPH10298265A | 1998-11-10 | |||
| JPH05302041A | 1993-11-16 | |||
| JPH10231339A | 1998-09-02 | |||
| JPH10298252A | 1998-11-10 | |||
| JPH10298254A | 1998-11-10 | |||
| JPH10298253A | 1998-11-10 | |||
| JPH1095937A | 1998-04-14 | |||
| JPH05202314A | 1993-08-10 | |||
| JP2001113649A | 2001-04-24 | |||
| JP2002069333A | 2002-03-08 | |||
| JPH04236266A | 1992-08-25 | |||
| JP2002012652A | 2002-01-15 | |||
| JP2003140147A | 2003-05-14 |
Other References:
See also references of EP 1561765A4
Attorney, Agent or Firm:
Miyakoshi, Noriaki (29th Floor ARK Mori Building, 12-32, Akasaka 1-chom, Minato-ku Tokyo, JP)
Download PDF: