Title:
RADIATION SENSITIVE COMPOSITION AND NOVEL COMPOUND
Document Type and Number:
WIPO Patent Application WO/2012/020627
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a radiation sensitive composition, or similar, capable of depositing a chemically amplified positive resist film which is effectively sensitive to KrF excimer lasers, ArF excimer lasers, (extreme) far ultra violet light such as EUV, x-rays such as synchrotron radiation, and electron beams, and which exhibits excellent nano edge roughness, sensitivity and resolution, and can stably and accurately form a micropattern. This radiation sensitive composition includes a solvent and an acid-generating agent represented by general formula (1). [In the formula, R1 independently represents a hydrogen atom, a fluorine atom or a substituted or unsubstituted organic group, with at least one R1 among the plurality of R1s representing a fluorine atom or an organic group wherein part or all of a hydrogen atom has been substituted with a fluorine atom. R2 independently represents a substituted or unsubstituted monovalent organic group having at least one ester bond. n represents an integer of 0-3. M+ represents a monovalent onium cation.]
Inventors:
MARUYAMA KEN (JP)
Application Number:
PCT/JP2011/066496
Publication Date:
February 16, 2012
Filing Date:
July 20, 2011
Export Citation:
Assignee:
JSR CORP (JP)
MARUYAMA KEN (JP)
MARUYAMA KEN (JP)
International Classes:
C07C309/17; C07C381/12; C08F12/04; C08F20/10; C08F20/56; G03F7/004; G03F7/039; H01L21/027
Foreign References:
| JP2009149588A | 2009-07-09 | |||
| JP2008069146A | 2008-03-27 | |||
| JP2008013551A | 2008-01-24 |
Attorney, Agent or Firm:
KOJIMA SEIJI (JP)
Seiji Kojima (JP)
Seiji Kojima (JP)
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Claims: