RADIATION-SENSITIVE COMPOSITION AND PROCESS FOR PRODUCING LOW-MOLECULAR COMPOUND FOR USE THEREIN

Title:

RADIATION-SENSITIVE COMPOSITION AND PROCESS FOR PRODUCING LOW-MOLECULAR COMPOUND FOR USE THEREIN

Document Type and Number:

WIPO Patent Application WO/2008/029673

Kind Code:

A1

Abstract:

A radiation-sensitive composition which comprises: (A) a low-molecular compound having, per molecule, one or more acid-dissociable groups which decompose by the action of an acid to enhance solubility in an alkaline developing solution and one or more radiation-sensitive acid-generating groups which generate an acid upon irradiation with actinic rays or a radiation and having a number-average molecular weight (Mn) in terms of polystyrene as measured by gel permeation chromatography (GPC) of 500-4,000; and (B) a solvent.

Inventors:

MATSUMURA NOBUJI (JP)
SHIMIZU DAISUKE (JP)
KAI TOSHIYUKI (JP)

Application Number:

PCT/JP2007/066644

Publication Date:

March 13, 2008

Filing Date:

August 28, 2007

Export Citation:

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Assignee:

JSR CORP (JP)
MATSUMURA NOBUJI (JP)
SHIMIZU DAISUKE (JP)
KAI TOSHIYUKI (JP)

International Classes:

G03F7/004; C07C309/12; C07C381/12; G03F7/039; H01L21/027

Domestic Patent References:

WO2006013687A1

2006-02-09

Foreign References:

JP2005189501A	2005-07-14
JP2006227331A	2006-08-31
JPH107650A	1998-01-13
JPH08248626A	1996-09-27
JPH08160606A	1996-06-21
JPH0912537A	1997-01-14
JP2007199692A	2007-08-09
JP2006201711A	2006-08-03
JP2006512600A	2006-04-13
JPH1083073A	1998-03-31
JP2000305270A	2000-11-02
JP2003183227A	2003-07-03
JPH10120610A	1998-05-12
JPH11322656A	1999-11-24
JP2003321423A	2003-11-11
JPH10310545A	1998-11-24

Other References: