RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMATION METHOD, ACID GENERATOR, AND COMPOUND

Title:

RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMATION METHOD, ACID GENERATOR, AND COMPOUND

Document Type and Number:

WIPO Patent Application WO/2023/119910

Kind Code:

A1

Abstract:

Provided is a radiation-sensitive composition containing: a polymer having an acid dissociable group; and at least one compound (b) selected from the group consisting of a compound represented by formula (1) and a compound represented by formula (2). In formula (1), R1 is a 1-20C monovalent organic group. R2 is either a single bond, or is a 1-20C bivalent group that bonds to the N- in formula (1) through -CR4R5- or an aromatic ring. Ma+ is an a-valent cation. In formula (2), R7 is a group having a partial structure in which an iodine atom is bonded to an aromatic ring. Mb+ is a b-valent cation.

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Inventors:

KINOSHITA NATSUKO (JP)
TANIGUCHI TAKUHIRO (JP)

Application Number:

PCT/JP2022/041361

Publication Date:

June 29, 2023

Filing Date:

November 07, 2022

Export Citation:

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Assignee:

JSR CORP (JP)

International Classes:

C07C311/09; G03F7/004; C07C311/21; C07C381/12; C07D307/00; C07D327/08; C07D333/76; C09K3/00; G03F7/039; G03F7/20

Foreign References:

JP2021182133A	2021-11-25
JP2016042161A	2016-03-31
JP2021165824A	2021-10-14

Attorney, Agent or Firm:

YAMADA, Tsuyoshi (JP)

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