Title:
RADIATION-SENSITIVE RESIN COMPOSITION AND COMPOUND CONTAINED THEREIN
Document Type and Number:
WIPO Patent Application WO/2011/077941
Kind Code:
A1
Abstract:
A radiation-sensitive resin composition comprising: a compound (A) represented by general formula (A) (wherein R1 and R2 independently represent a substituted or unsubstituted univalent hydrocarbon group having 1 to 25 carbon atoms; X and Z independently represent a substituted or unsubstituted bivalent hydrocarbon group having 1 to 25 carbon atoms; Y represents a single bond or the like; and n represents an integer of 0 to 5); a solvent (B); and a resin (C) having an acid-labile group.
Inventors:
MARUYAMA KEN (JP)
Application Number:
PCT/JP2010/071890
Publication Date:
June 30, 2011
Filing Date:
December 07, 2010
Export Citation:
Assignee:
JSR CORP (JP)
MARUYAMA KEN (JP)
MARUYAMA KEN (JP)
International Classes:
G03F7/004; C07C303/28; C07C309/75; H01L21/027
Foreign References:
| JP2005025150A | 2005-01-27 | |||
| US3748132A | 1973-07-24 | |||
| JPS5416562A | 1979-02-07 | |||
| JP2005088346A | 2005-04-07 | |||
| JP2004216716A | 2004-08-05 |
Attorney, Agent or Firm:
WATANABE, Kazuhira (JP)
Ippei Watanabe (JP)
Ippei Watanabe (JP)
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