Title:
RADIATION-SENSITIVE RESIN COMPOSITION AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2014/119777
Kind Code:
A1
Abstract:
Provided is a radiation-sensitive resin composition which contains (A) a binder resin, (B) a radiation-sensitive compound, (C) a crosslinking agent, (D) a sulfur-free semi-hindered phenolic antioxidant and/or a sulfur-free less-hindered phenolic antioxidant, and (E) a sulfur-containing phenolic antioxidant. The present invention is able to provide a radiation-sensitive resin composition which is capable of providing a resin film that has high exposure sensitivity and excellent shape retention performance after firing, while exhibiting high transparency even after being fired in an oxidizing atmosphere.
Inventors:
ABE SATOSHI (JP)
TSUTSUMI TAKASHI (JP)
TSUTSUMI TAKASHI (JP)
Application Number:
PCT/JP2014/052408
Publication Date:
August 07, 2014
Filing Date:
February 03, 2014
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
G03F7/004; C08K5/00; C08L101/00; G03F7/023; G03F7/40
Domestic Patent References:
| WO2011046230A1 | 2011-04-21 |
Foreign References:
| JP2005272495A | 2005-10-06 | |||
| JP2010224067A | 2010-10-07 | |||
| JP2012212039A | 2012-11-01 | |||
| JP2010034513A | 2010-02-12 | |||
| JP2013216782A | 2013-10-24 |
Attorney, Agent or Firm:
TOKOSHIE PATENT FIRM (JP)
It can exceed and is a patent business corporation. (JP)
It can exceed and is a patent business corporation. (JP)
Download PDF:
Previous Patent: GRAPHITE POWDER FOR NEGATIVE ELECTRODE ACTIVE MATERIAL OF LITHIUM-ION SECONDARY BATTERY
Next Patent: POWDER FILLING DEVICE
Next Patent: POWDER FILLING DEVICE