Title:
RADIATION-SENSITIVE RESIN COMPOSITION FOR IMMERSION EXPOSURE, CURING PATTERN FORMING METHOD AND CURING PATTERN
Document Type and Number:
WIPO Patent Application WO/2011/142403
Kind Code:
A1
Abstract:
Provided is a radiation-sensitive resin composition for immersion exposure, a curing pattern forming method and a curing pattern ideally used in an immersion exposure process for exposing a resist film via a liquid for immersion exposure, such as water. The radiation-sensitive resin composition for immersion exposure comprises a structure obtained by hydrolysis-condensation of a silane compound represented by the formula [R1
aSiX4-a] and/or a silane compound represented by the formula [SiX4], and contains a silicon-containing polymer having a weight average molecular weight of 1,000 to 200,000 according to GPC, a fluorine-containing polymer, and an acid generator. (In each formula: R1 represents a fluorine atom, an alkylcarbonyloxy group, or an alkyl group with 1 to 20 carbons; X represents a chlorine atom, a bromine atom, or OR (where R is a monovalent organic group); and a represents an integer from 1 to 3.)
Inventors:
HASEGAWA KOICHI (JP)
MIYATA HIROMU (JP)
YASUDA KYOYU (JP)
MIYATA HIROMU (JP)
YASUDA KYOYU (JP)
Application Number:
PCT/JP2011/060893
Publication Date:
November 17, 2011
Filing Date:
May 11, 2011
Export Citation:
Assignee:
JSR CORP (JP)
HASEGAWA KOICHI (JP)
MIYATA HIROMU (JP)
YASUDA KYOYU (JP)
HASEGAWA KOICHI (JP)
MIYATA HIROMU (JP)
YASUDA KYOYU (JP)
International Classes:
G03F7/075; C08F212/14; C08F220/22; C08F232/02; C08G77/04; C08G77/50; G03F7/004; G03F7/039; G03F7/38; G03F7/40; H01L21/027
Foreign References:
| JP2009098687A | 2009-05-07 | |||
| JPH09208704A | 1997-08-12 | |||
| JP2008107529A | 2008-05-08 | |||
| JP2008209739A | 2008-09-11 | |||
| JP2010018776A | 2010-01-28 | |||
| JP2008106110A | 2008-05-08 | |||
| JPS61189533A | 1986-08-23 |
Attorney, Agent or Firm:
KOJIMA SEIJI (JP)
Seiji Kojima (JP)
Seiji Kojima (JP)
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Claims: