Title:
RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, POLYMER AND COMPOUND
Document Type and Number:
WIPO Patent Application WO/2011/145702
Kind Code:
A1
Abstract:
Disclosed is a radiation-sensitive resin composition which is capable of providing a resist coating film that exhibits excellent drainability on the surface by having a high dynamic contact angle during the exposure in a liquid immersion lithography process, while suppressing the occurrence of development defects by being greatly decreased in the dynamic contact angle during the development. The radiation-sensitive resin composition is also capable of reducing the time necessary for change of the dynamic contact angle. Specifically disclosed is a radiation-sensitive resin composition which contains (A) a polymer that has a structural unit (I) represented by formula (1), and (B) a radiation-sensitive acid generator.
Inventors:
ASANO YUSUKE (JP)
OIZUMI YOSHIFUMI (JP)
SOYANO AKIMASA (JP)
ISHII TAKESHI (JP)
OIZUMI YOSHIFUMI (JP)
SOYANO AKIMASA (JP)
ISHII TAKESHI (JP)
Application Number:
PCT/JP2011/061587
Publication Date:
November 24, 2011
Filing Date:
May 19, 2011
Export Citation:
Assignee:
JSR CORP (JP)
ASANO YUSUKE (JP)
OIZUMI YOSHIFUMI (JP)
SOYANO AKIMASA (JP)
ISHII TAKESHI (JP)
ASANO YUSUKE (JP)
OIZUMI YOSHIFUMI (JP)
SOYANO AKIMASA (JP)
ISHII TAKESHI (JP)
International Classes:
C08F20/26; G03F7/039; G03F7/004; H01L21/027
Foreign References:
| JP2003183226A | 2003-07-03 | |||
| JP2009139909A | 2009-06-25 | |||
| JP2009271442A | 2009-11-19 |
Attorney, Agent or Firm:
AMANO KAZUNORI (JP)
Kazuki Amano (JP)
Kazuki Amano (JP)
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Claims: