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Patent Searching and Data


Title:
RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, ACID DIFFUSION CONTROL AGENT, AND COMPOUND
Document Type and Number:
WIPO Patent Application WO/2017/122697
Kind Code:
A1
Abstract:
The present invention provides a radiation-sensitive resin composition that contains: a first polymer having a first structural unit that contains a first acid-dissociable group; a radiation-sensitive acid generator; and a compound represented by formula (1). In formula (1), n is 1 or 2. When n is 1, R1 is a hydrogen atom or a C1-20 monovalent organic group. When n is 2, R1 is a C1-20 divalent organic group. R2 is a hydrogen atom or a C1-20 monovalent organic group. E is a group represented by formula (i). R2 and E may also combine with one another, and represent a 3- to 20-membered ring structure configured with a nitrogen atom to which R2 and E bond. In formula (i), X is a C1-20 divalent organic group, and R3 is a second acid-dissociable group that produces a sulfo group as a result of dissociation caused by acid activity.

Inventors:
KINOSHITA NATSUKO (JP)
NISHIKORI KATSUAKI (JP)
FURUICHI KOUTA (JP)
Application Number:
PCT/JP2017/000681
Publication Date:
July 20, 2017
Filing Date:
January 11, 2017
Export Citation:
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Assignee:
JSR CORP (JP)
International Classes:
G03F7/004; C07C309/69; C07D295/084; C07D295/15; G03F7/038; G03F7/039; G03F7/20
Domestic Patent References:
WO2015179441A22015-11-26
Foreign References:
JP2011138111A2011-07-14
JP2009086354A2009-04-23
JP2014085475A2014-05-12
JP2014062082A2014-04-10
JP2015113292A2015-06-22
JP2006512301A2006-04-13
US20090105254A12009-04-23
Attorney, Agent or Firm:
AMANO Kazunori (JP)
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