Title:
RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING RESIST PATTERN
Document Type and Number:
WIPO Patent Application WO/2021/215163
Kind Code:
A1
Abstract:
Provided is a radiation-sensitive resin composition capable of forming a resist pattern having excellent pattern shape. Also provided is a method for forming a resist pattern. This radiation-sensitive resin composition contains: a copolymer of a monomer mixture comprising at least a (meth)acrylic acid monomer having an acid-dissociable group and a monomer having a phenolic hydroxyl group; a radiation-sensitive acid generator; and a bisphenol compound.
Inventors:
MATSUMURA YUUSHI (JP)
KANEKO TETSUROU (JP)
MORI SHUTO (JP)
MATSUMOTO RYU (JP)
KANEKO TETSUROU (JP)
MORI SHUTO (JP)
MATSUMOTO RYU (JP)
Application Number:
PCT/JP2021/011465
Publication Date:
October 28, 2021
Filing Date:
March 19, 2021
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
C07C39/367; C08F222/20; G03F7/004; G03F7/039; G03F7/20
Foreign References:
| JP2003287890A | 2003-10-10 | |||
| JP2013167781A | 2013-08-29 | |||
| JPH07181680A | 1995-07-21 |
Attorney, Agent or Firm:
AMANO Kazunori (JP)
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