Title:
RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING RESIST PATTERN
Document Type and Number:
WIPO Patent Application WO/2023/195255
Kind Code:
A1
Abstract:
This radiation-sensitive resin composition comprises a first polymer and a compound. The first polymer has a first structural unit that contains a substructure in which a hydrogen atom in a carboxy group, phenolic hydroxyl group, or amide group is substituted by a group with formula (1); has a second structural unit that contains a phenolic hydroxyl group; and has a solubility in developer that is modified by the action of acid. The compound has a monovalent organic acid anion and a monovalent radiation-sensitive onium cation that contains an aromatic ring in which at least one hydrogen atom is substituted by a fluorine atom or a fluorine atom-containing group.
Inventors:
WATANABE DAICHI (JP)
TOMIHAMA MUNEHISA (JP)
NISHIKORI KATSUAKI (JP)
TOMIHAMA MUNEHISA (JP)
NISHIKORI KATSUAKI (JP)
Application Number:
PCT/JP2023/006294
Publication Date:
October 12, 2023
Filing Date:
February 21, 2023
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
G03F7/039; G03F7/004; G03F7/20
Domestic Patent References:
| WO2020129476A1 | 2020-06-25 | |||
| WO2022065025A1 | 2022-03-31 |
Foreign References:
| JP2022042967A | 2022-03-15 | |||
| JP2019101417A | 2019-06-24 | |||
| JP2018109765A | 2018-07-12 | |||
| JP2023002462A | 2023-01-10 | |||
| JP2022059571A | 2022-04-13 |
Attorney, Agent or Firm:
IKEDA Yoshinori (JP)
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