Title:
RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMATION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/067915
Kind Code:
A1
Abstract:
Provided are a radiation-sensitive resin composition and a pattern formation method that make it possible to form a resist film that has excellent sensitivity, CDU performance, and storage stability, even when next-generation technology is applied. According to the present invention, a radiation-sensitive resin composition contains: a resin that includes a structural unit that is represented by formula (1) (in which R1 is a hydrogen atom, a C1–5 alkyl group, or a C1–5 halogenated alkyl group, Rx is a monovalent C1–20 hydrocarbon group, n is an integer that is 0–14, and Ry is a fluorine atom, a C1–5 hydrocarbon group, or a C1–5 fluorinated hydrocarbon group, each Ry being the same or different); at least one type of salt that includes an organic acid anion portion and a cation portion; and a solvent. The salt includes a carboxylate anion in the organic acid anion portion, and at least a portion of the organic acid anion portion of the salt includes an iodine-substituted aromatic ring structure.
Inventors:
MARUYAMA KEN (JP)
Application Number:
PCT/JP2022/033095
Publication Date:
April 27, 2023
Filing Date:
September 02, 2022
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
G03F7/004; C08F220/10; C08K5/095; C08K5/17; C08K5/20; C08K5/375; C08K5/45; C08L101/02; G03F7/039; G03F7/20
Foreign References:
| JP2020112784A | 2020-07-27 | |||
| JP2018155902A | 2018-10-04 | |||
| JP2021096465A | 2021-06-24 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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