RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMATION METHOD, METHOD FOR MANUFACTURING SUBSTRATE, AND COMPOUND

WIPO Patent Application WO/2023/100574

A1

Provided are: a radiation-sensitive resin composition that can be formed into a resist film having satisfactory levels of sensitivity and CDU performance even when a next-generation technology is applied; and a pattern formation method.　The radiation-sensitive resin composition contains a compound A represented by formula (I). [Chemical 1] (In the formula, R1 is a (m+m')-valent organic group and has a cyclopropane ring skeleton, a cyclobutane ring skeleton, or both.　X1 is a group represented by formula (1-1) or a group represented by formula (1-2).　X2 is a group represented by formula (2-1) or a group represented by formula (2-2).　Y+ is a monovalent onium cation.　m is an integer of 1-2.　m' is an integer of 0-1.)　[Chemical 2] (In the formula, * represents a bond with another group.)　The radiation-sensitive resin composition also contains a resin B including a structural unit having an acid-dissociable group, a radiation-sensitive acid generator other than the compound A, and a solvent.

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NEMOTO RYUICHI (JP)
MITA MICHIHIRO (JP)
MIYAKE MASAYUKI (JP)

PCT/JP2022/040696

June 08, 2023

October 31, 2022

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JSR CORP (JP)

G03F7/004; C07C59/11; C07C61/04; C07C62/08; C07C62/24; C07C69/34; C07C309/12; C07C309/17; C07C381/12; G03F7/038; G03F7/039; G03F7/20; G03F7/32

WO2021220648A1

2021-11-04

JP2021096433A	2021-06-24
JP2012137686A	2012-07-19

UNIUS PATENT ATTORNEYS OFFICE (JP)

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