Title:
RADIATION-SENSITIVE RESIN COMPOSITION, POLYMER, MONOMER AND METHOD FOR PRODUCING RADIATION-SENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2011/070947
Kind Code:
A1
Abstract:
Disclosed are: a radiation-sensitive composition which is capable of providing a chemically amplified resist film that is effectively sensitive to electron beams or extreme ultraviolet light, has excellent nano-edge roughness, sensitivity and resolution, and is capable of stably and highly accurately forming a fine pattern; a novel sulfonic acid salt-containing polymer which is used for the composition; a novel monomer that is used for the polymer; and a method for producing a radiation-sensitive resin composition. Specifically disclosed is a radiation-sensitive resin composition which contains a solvent and a polymer that has a repeating unit represented by formula (I) and/or a repeating unit represented by formula (II).
Inventors:
MARUYAMA KEN (JP)
Application Number:
PCT/JP2010/071398
Publication Date:
June 16, 2011
Filing Date:
November 30, 2010
Export Citation:
Assignee:
JSR CORP (JP)
MARUYAMA KEN (JP)
MARUYAMA KEN (JP)
International Classes:
G03F7/039; C08F12/30; C08F20/38; C08F20/58; G03F7/004; H01L21/027
Foreign References:
| JP2010250290A | 2010-11-04 | |||
| JP2006171656A | 2006-06-29 | |||
| JP2007328060A | 2007-12-20 | |||
| JP2009263487A | 2009-11-12 |
Attorney, Agent or Firm:
KOJIMA SEIJI (JP)
Seiji Kojima (JP)
Seiji Kojima (JP)
Download PDF:
Previous Patent: IMAGE PROCESSING METHOD AND COMPUTER-READABLE RECORDING MEDIUM
Next Patent: METHOD FOR MANUFACTURING PURIFIED HYALURONIC ACIDS
Next Patent: METHOD FOR MANUFACTURING PURIFIED HYALURONIC ACIDS