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Patent Searching and Data


Title:
RADIATION-SENSITIVE RESIN COMPOSITION, POLYMER, AND COMPOUND
Document Type and Number:
WIPO Patent Application WO/2012/033138
Kind Code:
A1
Abstract:
The present invention relates to [A] a radiation-sensitive resin composition which contains a polymer having a constituent unit represented by formula (I). In formula (I), R1 represents a hydrogen atom or a methyl group; X represents a bivalent alicyclic hydrocarbon group which may have a substituent; Y represents a bivalent hydrocarbon group having 1-20 carbon atoms; and R2 represents a methyl group or a trifluoromethyl group. Y in formula (I) preferably represents an alkanediyl group having 2-4 carbon atoms. Preferably, the radiation-sensitive resin composition additionally contains [B] a radiation-sensitive acid generator.

Inventors:
NAKASHIMA HIROMITSU (JP)
KIMURA REIKO (JP)
NAKAHARA KAZUO (JP)
SATO MITSUO (JP)
Application Number:
PCT/JP2011/070401
Publication Date:
March 15, 2012
Filing Date:
September 07, 2011
Export Citation:
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Assignee:
JSR CORP (JP)
NAKASHIMA HIROMITSU (JP)
KIMURA REIKO (JP)
NAKAHARA KAZUO (JP)
SATO MITSUO (JP)
International Classes:
G03F7/039; C07C69/54; C08F20/28
Foreign References:
JP2007284381A2007-11-01
JPH1112325A1999-01-19
JPH1115164A1999-01-22
JPH1135848A1999-02-09
JP2005238816A2005-09-08
Attorney, Agent or Firm:
AMANO KAZUNORI (JP)
Kazuki Amano (JP)
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Claims: