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Patent Searching and Data


Title:
RADIATION-SENSITIVE RESIN COMPOSITION, RESIST PATTERN FORMING METHOD, RADIATION-SENSITIVE ACID GENERATOR AND COMPOUND
Document Type and Number:
WIPO Patent Application WO/2014/141979
Kind Code:
A1
Abstract:
The present invention is a radiation-sensitive resin composition which contains a radiation-sensitive acid generator and a polymer having a structural unit that contains an acid-cleavable group, and wherein the radiation-sensitive acid generator contains a compound represented by formula (1). In formula (1), each of R1 and R2 independently represents a monovalent organic group having 1-20 carbon atoms; each of R3, R4 and R5 independently represents a hydrogen atom or a monovalent organic group having 1-20 carbon atoms; the organic groups may combine together to form a ring structure having 1-20 carbon atoms together with a carbon atom to which the organic groups are bonded; n represents an integer of 1-4; and M+ represents a monovalent radiation-decomposable onium cation.

Inventors:
NII HIROYUKI (JP)
NAMAI HAYATO (JP)
IKEDA NORIHIKO (JP)
NAGAI TOMOKI (JP)
Application Number:
PCT/JP2014/055701
Publication Date:
September 18, 2014
Filing Date:
March 05, 2014
Export Citation:
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Assignee:
JSR CORP (JP)
International Classes:
G03F7/004; C07C309/19; C07D309/04; C07D339/08; G03F7/039
Foreign References:
JP2010250063A2010-11-04
JP2010197849A2010-09-09
JP2002214774A2002-07-31
JP2009275155A2009-11-26
JP2010282189A2010-12-16
JP2012190001A2012-10-04
JP2012078405A2012-04-19
Attorney, Agent or Firm:
AMANO KAZUNORI (JP)
Kazuki Amano (JP)
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