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Title:
RADIATION-SENSITIVE RESIN COMPOSITION, RESIST PATTERN FORMING METHOD, ACID DIFFUSION CONTROL AGENT, COMPOUND AND METHOD FOR PRODUCING COMPOUND
Document Type and Number:
WIPO Patent Application WO/2014/188762
Kind Code:
A1
Abstract:
The present invention is a radiation-sensitive resin composition which contains a polymer having a structural unit that contains an acid-cleavable group and a compound represented by formula (1). In formula (1), R1 represents a monovalent organic group having 1-30 carbon atoms; L represents a single bond, an oxygen atom or a sulfur atom; and M+ represents a monovalent radiation-decomposable onium cation. It is preferable that the monovalent organic group represented by R1 is a monovalent hydrocarbon group or a monovalent fluorinated hydrocarbon group and L is a single bond in formula (1). It is also preferable that the monovalent organic group represented by R1 is a monovalent hydrocarbon group, a monovalent fluorinated hydrocarbon group, a monovalent aliphatic heterocyclic group or a monovalent fluorinated aliphatic heterocyclic group and L is an oxygen atom or a sulfur atom in formula (1). It is preferable that the monovalent radiation-decomposable onium cation represented by M+ is one represented by formula (X). It is also preferable that this radiation-sensitive resin composition additionally contains a radiation-sensitive acid generator.

Inventors:
NAMAI HAYATO (JP)
Application Number:
PCT/JP2014/056379
Publication Date:
November 27, 2014
Filing Date:
March 11, 2014
Export Citation:
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Assignee:
JSR CORP (JP)
International Classes:
G03F7/004; C07C51/02; C07C59/185; C07C59/205; C07C59/21; C07C67/30; C07C69/36; C07C327/20; C07C381/12; C07D307/77; C07D313/04; C07D317/46; C07D317/72; C07D327/04; C08F212/14; C08F220/10; G03F7/038; G03F7/039; H01L21/027
Foreign References:
JP2001013687A2001-01-19
JP2002148790A2002-05-22
JP2005014603A2005-01-20
Attorney, Agent or Firm:
AMANO KAZUNORI (JP)
Kazuki Amano (JP)
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