Title:
RADIATION-SENSITIVE RESIN COMPOSITION AND RESIST-PATTERN FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/070327
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a radiation-sensitive resin composition having superior LWR performance, CDU performance, resolution, cross-sectional-shape rectangularity, and exposure margin. Provided is a radiation-sensitive resin composition that contains: a polymer component having first, second, and third structural units in the same or different polymers; and a radiation-sensitive acid generator component containing first and second radiation-sensitive acid generators, wherein the first structural unit contains a group represented by formula (1), the second structural unit contains a hydroxyl group bonded with an aromatic ring, and the third structural unit contains an acid-dissociable group, and wherein the first acid generator generates a sulfonic acid in which a fluorine atom or a monovalent fluorinated hydrocarbon group is bonded with a carbon atom adjacent to a sulfo group, and the second acid generator generates a sulfonic acid in which a fluorine atom or a monovalent fluorinated hydrocarbon group is not bonded with any of a carbon atom adjacent to a sulfo group and a carbon atom adjacent thereto or a carboxylic acid in which a fluorine atom or a monovalent fluorinated hydrocarbon group is bonded with a carbon atom adjacent to a carboxy group.
Inventors:
KANEKO TETSUROU (JP)
NARUOKA TAKEHIKO (JP)
NARUOKA TAKEHIKO (JP)
Application Number:
PCT/JP2017/036196
Publication Date:
April 19, 2018
Filing Date:
October 04, 2017
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
G03F7/039; C08F220/00; C09K3/00; G03F7/004; G03F7/20
Foreign References:
JP2008304590A | 2008-12-18 | |||
JP2007304537A | 2007-11-22 | |||
JP2012073606A | 2012-04-12 | |||
JP2011008237A | 2011-01-13 | |||
JP2016085382A | 2016-05-19 |
Attorney, Agent or Firm:
AMANO Kazunori (JP)
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