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Patent Searching and Data


Title:
RADIATION-SENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2010/007971
Kind Code:
A1
Abstract:
Disclosed is a radiation-sensitive resin composition which enables the production of a chemically amplified resist having excellent resolution performance and small nano edge roughness. The radiation-sensitive resin composition comprises (A) a radiation-sensitive acid generator having a partial structure represented by general formula (1) and (B) a resin. [In general formula (1), R1 represents a univalent hydrocarbon group, or the like.]

Inventors:
SHIMOKAWA TSUTOMU (JP)
EBATA TAKUMA (JP)
SAKAI KAORI (JP)
OIZUMI YOSHIFUMI (JP)
SOYANO AKIMASA (JP)
OTSUKA NOBORU (JP)
Application Number:
PCT/JP2009/062697
Publication Date:
January 21, 2010
Filing Date:
July 13, 2009
Export Citation:
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Assignee:
JSR CORP (JP)
SHIMOKAWA TSUTOMU (JP)
EBATA TAKUMA (JP)
SAKAI KAORI (JP)
OIZUMI YOSHIFUMI (JP)
SOYANO AKIMASA (JP)
OTSUKA NOBORU (JP)
International Classes:
G03F7/004; G03F7/039; H01L21/027
Domestic Patent References:
WO2006121096A12006-11-16
WO2008056796A12008-05-15
WO2008029673A12008-03-13
WO2007069640A12007-06-21
Foreign References:
JP2005112724A2005-04-28
Attorney, Agent or Firm:
WATANABE, Kazuhira (JP)
Ippei Watanabe (JP)
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