RADIATION-SENSITIVE RESIN COMPOSITION

WIPO Patent Application WO/2010/123101

A1

A radiation-sensitive resin composition which is a material for resists having excellent resolution, etc., the composition comprising (A) a compound represented by general formula (1): X+Z- (X+ is a cation represented by general formula (1-1) or (1-2), and Z- is an anion such as OH-), (B) a resin comprising repeating units represented by general formula (2) and repeating units represented by general formula (3), and (C) a radiation-sensitive acid generator. (In general formulae (1-1), (1-2), (2), and (3), R2 to R7 each is a hydrogen atom or the like; R8 is an alicyclic hydrocarbon group or the like; A is a single bond or the like; and R9 is a monovalent organic group.)

FUJISAWA TOMOHISA (JP)
MATSUDA YASUHIKO (JP)
HAMA YUKARI (JP)
SAKAI KAORI (JP)
KAWAKAMI TAKANORI (JP)
NISHIMURA YUKIO (JP)
SAKAKIBARA HIROKAZU (JP)
MATSUMURA NOBUJI (JP)
NAKAGAWA HIROKI (JP)

PCT/JP2010/057242

October 28, 2010

April 23, 2010

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JSR CORP (JP)
FUJISAWA TOMOHISA (JP)
MATSUDA YASUHIKO (JP)
HAMA YUKARI (JP)
SAKAI KAORI (JP)
KAWAKAMI TAKANORI (JP)
NISHIMURA YUKIO (JP)
SAKAKIBARA HIROKAZU (JP)
MATSUMURA NOBUJI (JP)
NAKAGAWA HIROKI (JP)

G03F7/004; C08F220/28; G03F7/039; H01L21/027

WO2008143301A1

2008-11-27

JP2007114431A	2007-05-10
JP2004101819A	2004-04-02
JP2003233190A	2003-08-22
JP2006301304A	2006-11-02
JP2003302760A	2003-10-24

WATANABE, Kazuhira (JP)
Ippei Watanabe (JP)

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