Title:
RADIATION-SENSITIVE RESIST COMPOSITION WITH HIGH HEAT RESISTANCE
Document Type and Number:
WIPO Patent Application WO/1999/000704
Kind Code:
A1
Abstract:
A highly radiation-sensitive resist composition which can form a highly heat-resistant resist image. This resist composition comprises a resist material and a polymer obtained by reacting (a) a xylylene compound, (b) salicylic acid, and (c) a 9,9'-bis(hydroxyphenyl)fluorene or a 3,3,3',3'-tetramethyl-2,3,2',3'-tetrahydro-(1,1')-spirobiindenediol and having a weight-average molecular weight of 1,000 to 5,000 and a T¿g? of 100 to 150 °C. Examples of the ingredient (c) include 9,9'-bis(4-hydroxyphenyl)fluorene and 3,3,3',3'-tetramethyl-2,3,2',3'-tetrahydro-(1,1')-spirobiindene-6,6'-diol. Although the resist material may be either of positive and negative resists, it preferably comprises an alkali-soluble resin and a quinonediazide sensitizer.
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Inventors:
ITO HIROMI (JP)
TANAKA HATSUYUKI (JP)
TANAKA HATSUYUKI (JP)
Application Number:
PCT/JP1998/002707
Publication Date:
January 07, 1999
Filing Date:
June 18, 1998
Export Citation:
Assignee:
CLARIANT INT LTD (CH)
ITO HIROMI (JP)
TANAKA HATSUYUKI (JP)
ITO HIROMI (JP)
TANAKA HATSUYUKI (JP)
International Classes:
G03F7/022; C08G61/02; C08L61/00; C08L65/00; G03F7/004; G03F7/023; G03F7/038; G03F7/039; (IPC1-7): G03F7/022; C08G61/02; C08K5/28; C08L61/08; G03F7/004; H01L21/027
Foreign References:
| JPH1045880A | 1998-02-17 | |||
| JPH08165335A | 1996-06-25 | |||
| JPH0990624A | 1997-04-04 | |||
| JPH05127374A | 1993-05-25 |
Other References:
See also references of EP 0922998A4
Attorney, Agent or Firm:
Kanao, Hiroki (Bandai Building 10-14, Kandaawajicho 2-chom, Chiyoda-ku Tokyo, JP)
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