Title:
RADIATOR
Document Type and Number:
WIPO Patent Application WO/2016/013072
Kind Code:
A1
Abstract:
Provided is a radiator whereby an increase of a heat exchanger plate thickness and an increase of an installation space can be suppressed.
The present invention is characterized by being provided with: a heat pipe (10); a heat exchanger plate (20) that is provided at one end section of the heat pipe (10); and a heat dissipating fin (30) that is provided at the other end section of the heat pipe (10). The present invention is also characterized in that: the heat pipe (10) is provided with a linear section (11), and a bulging section (12) that is provided at one end of the linear section (11); and the bulging section (12) is embedded in the heat exchanger plate (20).
Inventors:
NAKAMURA TAKUMI (JP)
HINO HARUMICHI (JP)
OKUNO TETSUNOBU (JP)
LAI YAWHUEY (CN)
HINO HARUMICHI (JP)
OKUNO TETSUNOBU (JP)
LAI YAWHUEY (CN)
Application Number:
PCT/JP2014/069462
Publication Date:
January 28, 2016
Filing Date:
July 23, 2014
Export Citation:
Assignee:
NIPPON LIGHT METAL CO (JP)
TAI SOL ELECTRONICS CO LTD
TAI SOL ELECTRONICS CO LTD
International Classes:
F28D15/02; H01L23/427
Domestic Patent References:
| WO2010041529A1 | 2010-04-15 |
Foreign References:
| JPH0262067A | 1990-03-01 | |||
| JPH02130948A | 1990-05-18 | |||
| US20040035558A1 | 2004-02-26 | |||
| JP2012057906A | 2012-03-22 | |||
| JP2004071635A | 2004-03-04 | |||
| US20080257527A1 | 2008-10-23 | |||
| US6725909B1 | 2004-04-27 | |||
| US20090025909A1 | 2009-01-29 | |||
| JP2011040778A | 2011-02-24 |
Attorney, Agent or Firm:
ISONO INTERNATIONAL PATENT OFFICE, P. C. (JP)
Patent business corporation Isono international patent trademark office (JP)
Patent business corporation Isono international patent trademark office (JP)
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