Title:
RADICALLY CURABLE RESIN COMPOSITION, PAVING MATERIAL USING SAME, AND PAVED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2011/048970
Kind Code:
A1
Abstract:
Disclosed is a radically curable resin composition which contains a radically curable resin (A) that is composed of one or more resins selected from among epoxy (meth)acrylate resins and urethane (meth)acrylate resins, and a (meth)acrylic copolymer (E) that has a weight average molecular weight of 20,000-50,000 and contains 5% by mass or more but less than 70% by mass of a butyl (meth)acrylate as a copolymerization component. Consequently, the radically curable resin composition exhibits excellent tire contamination resistance and excellent tensile properties after curing. In addition, the radically curable resin composition contains a polymerizable unsaturated monomer (B) that is composed of a (meth)acrylic compound, namely a mixture of a (meth)acrylic compound (B-1) having a flash point of not less than 70°C and a (meth)acrylic compound (B-2) having a flash point of less than 21°C, said mixture having a mixing mass ratio (B-1)/(B-2) of from 9/1 to 5/5. Consequently, the radically curable resin composition meets the qualification for category 2 petroleum prescribed by the Fire Service Law and has low flammability, low odor, low viscosity and excellent compatibility.
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Inventors:
MATSUMOTO Takashi (Sakai Plant 3, Takasago 1-chome, Takaishi-sh, Osaka 01, 〒5920001, JP)
松本 高志 (〒01 大阪府高石市高砂一丁目3番地 DIC株式会社 堺工場内 Osaka, 〒5920001, JP)
KAWAI Isao (Sakai Plant 3, Takasago 1-chome, Takaishi-sh, Osaka 01, 〒5920001, JP)
松本 高志 (〒01 大阪府高石市高砂一丁目3番地 DIC株式会社 堺工場内 Osaka, 〒5920001, JP)
KAWAI Isao (Sakai Plant 3, Takasago 1-chome, Takaishi-sh, Osaka 01, 〒5920001, JP)
Application Number:
JP2010/067831
Publication Date:
April 28, 2011
Filing Date:
October 12, 2010
Export Citation:
Assignee:
DIC Corporation (35-58, Sakashita 3-chome Itabashi-k, Tokyo 20, 〒1748520, JP)
DIC株式会社 (〒20 東京都板橋区坂下三丁目35番58号 Tokyo, 〒1748520, JP)
MATSUMOTO Takashi (Sakai Plant 3, Takasago 1-chome, Takaishi-sh, Osaka 01, 〒5920001, JP)
松本 高志 (〒01 大阪府高石市高砂一丁目3番地 DIC株式会社 堺工場内 Osaka, 〒5920001, JP)
DIC株式会社 (〒20 東京都板橋区坂下三丁目35番58号 Tokyo, 〒1748520, JP)
MATSUMOTO Takashi (Sakai Plant 3, Takasago 1-chome, Takaishi-sh, Osaka 01, 〒5920001, JP)
松本 高志 (〒01 大阪府高石市高砂一丁目3番地 DIC株式会社 堺工場内 Osaka, 〒5920001, JP)
International Classes:
C08F290/06; E01C7/35
Attorney, Agent or Firm:
KONO Michihiro (7-20 Nihonbashi 3-Chome, Chuo-k, Tokyo 33, 〒1038233, JP)
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